Custom packages
Assembly Technology
- Wafer Sawing for Si and SiC die
- Pb and Pb-free Vacuum D/A Soldering
- Pressure and Pressure-less Ag-Sintering
- Multi-Die and Stack-Assy options
- SMT Assembly integration
- Heavy Aluminum, Cu-core-Al and Copper Wirebonding
- Ultrasonic Terminal Welding
- Standard and High CTI Plastic Housing
- High Tg and High CTI Mold Compound
- Standard and Press-fit-pin terminals
- Cu Baseplate with Pin-fin option
- Static Test (Room Temp/Hot Temp)
Certification
- ISO 14001, IATF 16949