Assembly Technology
- Wafer Sawing for Si and SiC die
- Pb and Pb-free softsolder D/A
- Pressure-less Ag Sintering
- Multi- and Stack-die options
- Heavy Aluminum and Cu-core-Al Wirebonding
- RoHS and High CTI Mold compound
- Sn-plating
- Static Test – Room Temperature
Certification
- ISO 14001, IATF 16949
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